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                Design & Characterization

                Characterization Services

                As the electronics industry moves towards more complex semiconductor packages that are smaller, faster and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation.

                JCET offers the following characterization services:

                Thermal Analysis Mold Flow Analysis Mechanical Analysis Electrical Analysis

                JCET’s worldwide package characterization teams located in China, Singapore, South Korea, and the United States provide advanced package characterization services for our global customers to ensure they have high quality, high performance, reliable and cost effective package designs that meet their market requirements.

                Full-Service Packaging Design Centers

                JCET collaborates with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost. JCET’s full-service package Design Centers help customers determine the optimum package for their specific end product.

                Design Center services include:

                ? Customer-centric designers
                ? Mobile design capability
                ? State-of-the-art design tools
                ? Integration of customer supplied designs into JCET’s design system
                ? Project data management

                Proven Experience

                JCET’s world class design team has extensive experienced in the mobile, networking, computing, consumer and automotive markets. Their experience covers a wide range of Laminate, leadframe and wafer level package designs, including single die, multi-die, Package-on-Package (PoP), Integrated Passive Devices (IPD) and advanced System-in-Package (SiP). JCET’s dedicated design team has the necessary experience to provide complex designs that meet or exceed assembly and cost targets.

                Design for Performance

                Today's package designs adhere to stringent thermal and electrical requirements while providing high-end performance for our customers’ end products. To ensure a semiconductor package meet performance requirements, JCET’s Design and Characterization Team works closely with the customer through co-design while the integrated circuit (IC) is in development. The “Co-Design” of a package provides the best environment for optimum performance. JCET’s package designs meet our customers’ needs whether as a single chip device or complex System-in-Package (SiP).

                The Design Process

                JCET manages the design process using our Product Data Management system. From the moment a request enters our system the design team works with our characterization experts and our customers to understand their needs for each design. As each new design is received, it undergoes a feasibility to determine if the package will meet the requirements of our factories, suppliers and customers. Our designers collaborate with customers to ensure the optimum package is produced with consideration to cost, assembly and function.

                Design Tool Sets

                ? Cadence: SiP and APD
                ? AutoDesk: AutoCad
                ? Downstream: CAM350
                ? Internally developed support tools