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                JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. 

                Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.

                Milestones

                1972

                Jiangyin Transistor Factory Established

                1989

                First Automated IC Assembly Line Started Production

                2000

                Company Restructured to JCET

                2003

                JCAP Established

                2003

                JCET Listed on Shanghai Stock Exchange

                2011

                JCET D8 (Suqian) Established

                2012

                JCET D9 (Chuzhou) Established

                2015

                JCET Acquired STATS ChipPAC

                2020

                JCET Management Co., Ltd. Established