• <tr id='ddBewB'><strong id='ddBewB'></strong><small id='ddBewB'></small><button id='ddBewB'></button><li id='ddBewB'><noscript id='ddBewB'><big id='ddBewB'></big><dt id='ddBewB'></dt></noscript></li></tr><ol id='ddBewB'><option id='ddBewB'><table id='ddBewB'><blockquote id='ddBewB'><tbody id='ddBewB'></tbody></blockquote></table></option></ol><u id='ddBewB'></u><kbd id='ddBewB'><kbd id='ddBewB'></kbd></kbd>

    <code id='ddBewB'><strong id='ddBewB'></strong></code>

    <fieldset id='ddBewB'></fieldset>
          <span id='ddBewB'></span>

              <ins id='ddBewB'></ins>
              <acronym id='ddBewB'><em id='ddBewB'></em><td id='ddBewB'><div id='ddBewB'></div></td></acronym><address id='ddBewB'><big id='ddBewB'><big id='ddBewB'></big><legend id='ddBewB'></legend></big></address>

              <i id='ddBewB'><div id='ddBewB'><ins id='ddBewB'></ins></div></i>
              <i id='ddBewB'></i>
            1. <dl id='ddBewB'></dl>
              1. <blockquote id='ddBewB'><q id='ddBewB'><noscript id='ddBewB'></noscript><dt id='ddBewB'></dt></q></blockquote><noframes id='ddBewB'><i id='ddBewB'></i>

                JCET Participating at the 2021 World Semiconductor Conference

                2021-06-09

                June 9th, 2021, Shanghai, China - On June 9th, with the theme of "Innovation for Development, Win-win for Growth", the 2021 World Semiconductor Conference was kicked off at Nanjing International Expo Center. Mr. Zheng Li, Chief Executive Officer of JCET, participated in the opening session of the conference with his keynote speech sharing JCET’s latest innovations as well as his vision for the future development of the industry. Throughout the conference, JCET is also showcasing its advanced chip manufacturing technologies and service solutions for smart applications in Hall 4, Booth C01 of the conference exhibits.  

                In the post-Moore era, the accelerated popularity of emerging technologies and applications such as 5G, Artificial Intelligence and the Internet of Things has put forward higher requirements for chipsets in performance, integration and customization. These requirements have led to fundamental changes in chipset manufacturing moving from traditional "packaging" technologies to "dense" and "interconnect" based advanced integration. This advanced level integration has become an indispensable technology necessary for the continuous development of IC industry. In his speech titled "Breakthrough in Advanced Chipset Manufacturing in the Post-Moore Era", Mr. Li Zheng, CEO of JCET shared that Advanced semiconductor backend manufacturing is a defining technology in the post-Moore era, and JCET’s XDFOI™ innovation integrates core technologies to achieve heterogeneous integration flexibly, taking JCET to the next level with our technology innovations. Mr. Zheng also made the remark that the importance of advanced semiconductor backend manufacturing is becoming more and more evident, and co-design can significantly improve efficiency by optimizing the integration of finished chip integration and testing. JCET will continue to innovate and promote these types of developments in the industry.

                JCET CEO, Mr. Li Zheng Addressing in Keynote @ WSCE

                JCET has strengthened its investment in R&D and innovation to build its own competitive differentiation, and is committed to promoting win-win cooperation within the industry ecosystem. The recently established "Design Service Business Center" and "Automotive Electronics Business Center" are examples of this strategy. The two business centers will provide seamless and efficient full lifecycle technology support services to customers by leveraging JCET’s accumulated industry know-how and partner resources. 

                JCET is also participating in the 2021 World Semiconductor Conference with their exhibit located in Hall 4, Booth C01. With the theme “Providing advanced and reliable integrated circuit back-end manufacturing technology and services for a smarter world," JCET’s booth focuses on system-in-package (SiP), wafer level packaging (WLP), flip chip and other packaging technologies applied in four major applications: 5G communication, automotive electronics, high performance computing and storage. The exhibit further demonstrates JCET’s strength in enabling innovative applications based on rich technology accumulation and forward-looking technology knowhow.

                 

                JCET Booth @ WSCE China 2021 

                 

                Booth Highlights. 

                l  Automotive Electronics: fcCSP and FOWLP technologies for driverless technology, QFN/FC and QFN/DFN technologies for new energy vehicles, and QFN/DFN and fcBGA technologies for in-car entertainment.

                l  5G: SiP and FOWLP technologies for baseband chips, SiP and fcCSP technologies for RF chips, and fcBGA and HD FOWLP technologies for communication infrastructure.

                l  High performance computing: fcCSP and fcBGA technologies primarily applied in artificial intelligence chips and blockchain, showcasing the outstanding performance support for high-end applications with advanced packaging technology from JCET.

                l  High-end Storage: Focusing on multi-chip stacked FBGA and SiP technologies for flash memory and eMCP and uMCP technologies for mobile memory (Flash+DRAM).